Single-Crystal Diamond for Precision Tools and CMP Applications
With ultra-high hardness, wear resistance and corrosion resistance, diamond is used in tools for sawing, cutting, grinding and drilling as well as precision machining. Large, high-quality single-crystal CVD diamond can also be used for demanding cutting applications and CMP processes in the semiconductor industry.
Typical Material Parameters
| Property | Unit | Typical / Reference |
| Hardness | kg/mm² | 10400 |
| Young’s modulus | GPa | 1100–1300 |
| Roughness — both sides | nm | <30, polished |
| Face orientation | — | 100 |
| Edge orientation | — | 110 |
Single Crystal Diamond (SCD) Cutting Tools
Andrews supplies both ready-to-use single-crystal diamond tools and SCD blanks or tips for secondary processing by European precision toolmakers and machining specialists.
Two Supply Pathways
- Ready-to-Use Precision Tools — finished, factory-inspected single-crystal diamond tools for ultra-precision turning, milling and grooving.
- Premium Blanks & Tips for Secondary Processing — high-purity, accurately oriented SCD blanks and tips for customers carrying out their own grinding, soldering and value-added manufacturing.
Core Advantages
- Controlled crystal quality for uniform hardness, thermal conductivity and structural integrity
- Competitive supply for material and tooling
- Customized crystallographic orientation according to customer requirements
- European supply interface with flexible quantities and coordinated delivery
SCD Array CMP Pad Conditioner
The source product uses a one-piece synthetic single-crystal diamond (SSCD) array for CMP pad conditioning. The design is intended to improve removal-rate control, within-wafer non-uniformity and micro-scratch control, while reducing pad overcutting and extending pad and conditioning-disk life.
- Array made from single-crystal diamond with laser sculpturing
- Diamond tips leveled to the same height and angle for shallow and even pad penetration
- Tip height, angle and pitch can be customized by CAD for individual CMP processes
- Removal rate, within-wafer non-uniformity and micro-scratch control can be optimized
Development & Testing Status
According to the supplied product information, the first-generation product was tested by Fraunhofer IPMS in 2025. An upgraded version was subsequently tested on a partner platform in China.
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